Speedline Technologies’ New Benchmark 5.0 Software Delivers Improved Throughput, Control and Functionality for Camalot XyflexPro Dispensing Systems

Speedline Technologies (www.speedlinetech.com) announced today the release of Benchmark 5.0 software for its Camalot XyflexPro liquid dispensing system for surface mount electronics and chip packaging applications.

Franklin, Mass. (PRWEB) August 16, 2005 -- Speedline Technologies announced today the release of Benchmark 5.0 software for its Camalot XyflexPro liquid dispensing system for surface mount electronics and chip packaging applications.

The new release offers XyflexPro users significant benefits, including increased throughput of up to 15%, improved process control and enhanced program functionality.

New features include a unique Flip Chip Calculator, used to determine Underfill weight and volume for both die within a cavity and standard assembly methods.

“TurnBack,” another new function of Benchmark, allows any of the Dispense Units or Pumps to be reversed. This gives precise control of material on the needle tip and can be used to eliminate material balling or dripping due to backpressure.

Benchmark 5.0 also features Die Edge Detection, a 1 snap process that simultaneously finds all 4 edges of a Flip Chip ensuring pinpoint positioning. The vision algorithms have been further developed for edge find of any rotated die, CSP/BGA’s and other molded packages.

In addition, cycle time is dramatically decreased with Benchmark 5.0, through the result of “creative concepts based on the expertise we’ve achieved in close consultation with customers,” said Hugh Read, Speedline Technologies, Product Manager Dispensing Equipment.

These include a unique Line Sequence command, which enables faster, smoother travel around corners when dispensing Underfill; Encapsulation and Micro Display applications; needle cleaning during product transfer not during valuable process time; faster vision processing; and a pipeline conveyor mode that allows parallel product transfer between conveyor zones, reducing transfer time by up to 40%.

Benchmark 5.0 is easily upgradeable and adds even more flexibility to the industry’s most configurable dispense system. It is available as an option for all existing XyflexPro users and is shipped as standard on the new XyflexPro+ dispensing systems.

The new software release is immediately available. For more information, contact your local Speedline Technologies representative, or contact Speedline Technologies directly at 1-508-520-0083. Visit us at http://www.speedlinetech.com.

About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan’s “2005 Surface Mount Technology Company of the Year.”

For more information about Speedline Technologies, visit us on the net: http://www.speedlinetech.com or contact Speedline at:
• USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: e-mail protected from spam bots
• Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: e-mail protected from spam bots;
• Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: e-mail protected from spam bots.

Note to Editors: Download high resolution photo from: http://www.tizinc.com/speedline/Benchmark-5.0-software-screen.jpg

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Source :  http://www.prweb.com/releases/2005/8/prweb271540.htm